Inline System
Rigid Inline System
Foldable Phone System
R-Hybrid Inline System
F-Hybrid Inline System
Hybrid Inline System
Organizing Equipment
Organizing Equipment
LD / CLEANER / COG / FOG / AOI / CRD / TFOG / ULDEquipment Explanation
Equipment Explanation
Bonding Chip & FPC to rigid panel Inspection of bonding surface alignment, conductive ball and indentation Applying stiffener and harden panels using UV Bonding TFPC to touch panelBAEG HONG TAE010 5376 5512
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Organizing Equipment
Organizing Equipment
LD / CLEANER / COP or COF / AOI / FOP or FOF / AOI / CRD+2D PRINT / ULDEquipment Explanation
Equipment Explanation
Equipment solely for the production of foldable phones. Developed for the first time in the world. Currently we are the sole supplier to Samsung. Supplying materials automatically using the manually inserted tray by the operator Bonding chips to plastic panels Inspection equipment of bonding surface alignment, conductive ball and indentation Inspection equipment of the resistance of FPC Applying stiffener and harden panels using UV Printing 2D panel code to FPC and check the code with MCR camera Discharging panels automatically using the unloaderBAEG HONG TAE010 5376 5512
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Organizing Equipment
Organizing Equipment
LD / CLEANER / COG+COF / AOI / FOG+FOF / AOI + ART / CRD+2D PRINT / TFOG / ULDEquipment Explanation
Equipment Explanation
Bonding Chip(or TAB IC) & FPC to rigid panels Inspection of bonding surface alignment, conductive ball and indentation Applying stiffener and harden panels using UV Bonding TFPC to touch panelBAEG HONG TAE010 5376 5512
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Organizing Equipment
Organizing Equipment
LD / CLEANER / COP+COF / AOI / FOP+FOF / AOI+ART / CRD + 2D PRINT / ULDEquipment Explanation
Equipment Explanation
Supplying materials automatically using the manually inserted tray by the operator Bonding chips(or TAB IC) to flexible panels Inspection equipment of bonding surface alignment, conductive ball and indentation Inspection equipment of the resistance of FPC Applying stiffener and harden panels using UV Printing 2D panel code to FPC and check the code with MCR camera Discharging panels automatically using the unloaderBAEG HONG TAE010 5376 5512
ask more information
Organizing Equipment
Organizing Equipment
LD / CLEANER / COG+COF+COP / AOI / FOG+FOF+FOP / AOI+ART+CRD+2D PRINT / ULDEquipment Explanation
Equipment Explanation
Equipment compatible between R-Hybrid Inline System and F-Hybrid Inline System (Only for R&D)BAEG HONG TAE010 5376 5512
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