Single process equipment
PANEL LOADER
Equipment to supply materials automatically using the manually inserted tray by the operator
CLEANEING M/C
Equipment that uses plasma to clean organic matter from pressed surfaces
COG/COF/COP BONDING
Equipment to activate a bonding surface with atmospheric pressure plasma treatment and to bond a panel electrode to a chip(TAB) electrode using ACF(Anisotropic conductive film) after removing organic matter.- · COG : Chip on glass
- · COF : Chip on film
- · COP : Chip on plastic panel
AOI+ART
- · AOI (Auto optical inspection) : Inspection equipment of bonding surface alignment, conductive ball and indentation
- · ART (Auto resistance tester) : Inspection equipment of the resistance of FPC
- · FPC : Flexible printed circuit
CRD + 2D PRINT
- · CRD (Cover resin dispenser) : Equipment to apply stiffener and harden panels using UV
- · 2D PRINT : Equipment to print 2D panel code to FPC and check the code with MCR camera
FOG/FOF/FOP BONDING
Equipment to bond to panels(or FPC) in FPC(or COF) at high temperature and high pressure using the ACF for current flow.- · FOG : FPC on glass
- · FOF : FPC on film
- · FOP : FPC on plastic panel
TFOG
Equipment to bond TFPC to the panel at high temperature and high pressure using ACF to enable current flow.- · TFPC : Touch FPC
- · TFOG : TFPC on glass
TFOF
Equipment to bond TFPC to FPC at high temperature and high pressure using ACF to enable current flow.BAEG HONG TAE010 5376 5512
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